Dr. Masahiro Murakawa and his colleague of the Advanced Semiconductor Research Center (ASRC), National Institute of Advanced Industrial Science and Technology (AIST), one of independent administrative ...

In addition to the 2, 3 and 4-axis versions, an optional pitch/yaw module allows for full adjustment in all six degrees of freedom. Other configurations are available for applications with different ...

LoginForgot password?Send Reset LinkBack to login. 1.12. 2D to 3D EIC/PIC integration options 1.13. Benchmark table of different packaging technologies for EIC/PIC 1.14. Examples of packaging a 3D ...

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding ...

LoginForgot password?Send Reset LinkBack to login. 1.12. 2D to 3D EIC/PIC integration options 1.13. Benchmark table of different packaging technologies for EIC/PIC 1.14. Examples of packaging a 3D ...

PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate ...

One approach to creating a quantum computer is to use trapped ions, which rely on lasers delivered by optical fibers for quantum control. Our robust feedback control system uses a six-axis stage to ...

(Nanowerk News) PI's new F-141 photonics alignment system provides high throughput with motion in 4 and 6 degrees of freedom for industrial test and assembly of photonic integrated circuits (PIC).